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(R)
ESDA18-1F2
TRANSILTM: Transient Voltage Suppressor
ASD
(Application Specific Devices)
FEATURES AND BENEFITS:

Stand-off voltage 16V Unidirectional device Low clamping factor VCL/VBR Fast response time Very thin package: 0.65 mm Flip-Chip (4 Bumps) Table 1: Order Code Part Number ESDA18-1F2 Marking EE
DESCRIPTION The ESDA18-1F2 is a single line Transil diode designed specifically for the protection of integrated circuits into portable equipment and miniaturized electronics devices subject to ESD & EOS transient overvoltages.
COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 15kV (air discharge) 8kV (contact discharge)
Figure 1: Pin Configuration (ball side)
A
K
B 1
A
2
K A
K
A
TM: TRANSIL is a trademark of STMicroelectronics.
May 2005
REV. 1
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ESDA18-1F2
Table 2: Absolute Ratings (limiting value, per diode) Symbol Parameter and test conditions Peak pulse power dissipation 10 / 1000 s pulse Peak pulse power dissipation 8 / 20 s pulse Non repetitive surge peak forward current Maximum operating junction temperature Storage temperature range Value 100 Tj initial = Tamb 700 tp=10 ms Tj initial = Tamb 8 125 - 65 to + 175 A C C W Unit
PPP
IFSM Tj Tstg
Table 3: Electrical Characteristics (Tamb = 25C) Symbol VBR IRM VRM VCL Rd IPP C Parameter Breakdown voltage Leakage current Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Capacitance
Slope: 1/Rd IPP VF VCL VBR VRM IRM V IF I
VBR Part Number min. V ESDA18-1F2 16
(1) 8 / 20 s pulse waveform.
IR
IRM max.
VRM
VCL max.
IPP (1)
VF (2) max. IF = 850mA
T max. 10-4/C 8.5
C typ. VR=0V pF 230
max. V 18 mA 1
A 0.5
V 10
V 20
A 1
V 1.3
(2) DC current not recommended for more than 5 sec. Even if Transil failure mode is short circuit the bumps could exceed melting temperature and the component disassembled from the board.
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Figure 2: Relative variation of peak pulse power versus initial junction temperature
PPP[Tj initial] / PPP[Tj initial=25C)
1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 100 1000 10000
Tj initial=25C
Figure 3: Peak pulse power versus exponential pulse duration
PPP(W)
Tj(C)
10 1 10
tp(s)
100 1000
Figure 4: Clamping voltage versus peak pulse current (typical values, exponential waveform)
IPP(A)
100.0
8/20s Tj initial=25C
Figure 5: Forward voltage drop versus peak forward current (typical values)
IFM(A)
1.E+01
1.E+00 10.0
Tj=125C
Tj=25C
1.E-01
1.0 1.E-02
VCL(V)
0.1 10 12 14 16 18 20 22 24 26 28 30 1.E-03 0.0 0.2 0.4 0.6 0.8
VFM(V)
1.0 1.2 1.4 1.6 1.8 2.0
Figure 6: Junction capacitance versus reverse voltage applied (typical values)
C(pF)
300
F=1MHz VOSC=30mVRMS Tj=25C
Figure 7: Relative variation of leakage current versus junction temperature (typical values)
IR[Tj] / IR[Tj=25C]
100
VR=10V
250
200
150
10
100
50
VR(V)
0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 25 50
Tj(C)
75 100 125
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One major point is that the ESDA18-1F2 has to ensure the safety during reverse battery operation. Indeed, during this operation the device must clamp the DC reverse voltage below 1.3V @ 0.85A (max current). Thus reverse battery operation has been simulated by inverting the polatrity of the TRANSIL (please see figures 8 and 9) Figure 8: Reverse battery operation setup
Equivalent mobile phone impedance PTC Vmains I V 4.7k 1nF
ESDA18-1F2
Figure 9: Reverse battery operation results
A short calculation based on Reverse battery operation results figures clearly show that in such real phone application the ESDA18-1F2 clamp the DC voltage below 1.3V. Typically the ESDA18-1F2 can clamp the DC voltage @ 0.9V @0.76A DC current:
2 x V max 2 x 1.4 V DC = ---------------------- ----------------- 0.9V 3.14 2 x I max 2 x 1.2 I DC = -------------------- ----------------- 0.76A 3.14
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ESDA18-1F2
Figure 10: Ordering Information Scheme
ESDA
ESD Array Breakdown Voltage 18 = 18 Volts max. Number of line 1 = signle line Package F = Flip-Chip x = 2: Leadfree Pitch = 500m, Bump = 315m
Figure 11: FLIP-CHIP Package Mechanical Data
18 - 1
Fx
500m 50
650m 65 315m 50
0.95mm 50m
Figure 12: Foot Print Recommendations
0.95mm 50m
500m 50
Figure 13: Marking
Copper pad Diameter : 250m recommended , 300m max
Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week)
365
240
365
E
Solder stencil opening : 330m
Solder mask opening recommendation : 340m min for 315m copper pad diameter
All dimensions in m
xxz y ww
40
220
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ESDA18-1F2
Figure 14: FLIP-CHIP Tape and Reel Specification
Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1
1.75 +/- 0.1 3.5 +/- 0.1
0.73 +/- 0.05
All dimensions in mm
Table 4: Ordering Information Ordering code ESDA18-1F2 Marking EE Package Flip-Chip Weight 1.25 mg Base qty 5000 Delivery mode Tape & reel 7"
Note: More packing informations are available in the application note AN1235: "Flip-Chip: Package description and recommendations for use"
8 +/- 0.3
STE
STE
STE
xxx yww
User direction of unreeling
xxx yww
xxx yww
4 +/- 0.1
Table 5: Revision History Date 09-May-2005 Revision 1 First issue. Description of Changes
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ESDA18-1F2
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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